• United States Of America, Usa

Job Description:

At AMD, we push the boundaries of what is possible We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies building blocks for gaming, immersive platforms, and the data center

Developing great technology takes more than talent it takes amazing people who understand collaboration, respect, and who will go the extra mile to achieve unthinkable results It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world If you have this type of passion, we invite you to take a look at the opportunities available to come join our team

We are looking for a thermal mechanical expert with a background working from the silicon die level to the server system level The positions primary task will be developing thermal models of SOCs which are then used by internal customers and external customers The external models will be in IcePak or FloTherm for general system level optimization work The internal models will be simplified representations allowing silicon architects to study tradeoffs of power levels and transient power limits in localized die areas A successful candidate will possess deep technical knowledge/experience on methodologies and experimentation to validate thermal models


Thermal and mechanical modeling and testing of components
Part and assembly design, from concept to detail design to manufacturing introduction
Validation of components in bench and system configuration
Produce and maintain detailed technical documentation for customer consumption
Create, manage, release, and maintain BOMs and assembly instructions
Provide comprehensive customer support
Coordinate with platform engineers and engineers from other internal teams to ensure that all design requirements are satisfied
Work with EEs and PCB engineers to develop and fine tune PCBA board layouts and outlines
Oversee product shipping packaging testing and provide guidance for packaging design
Demonstrated successful experience in mechanical engineering within a product design and manufacturing environment


Strong analytical skills, including structural (FEA, Ansys preferred) and thermal modelling (CFD, FloTherm, Icepak preferred)
Proficiency in CAD modeling, solid and sheetmetal (SolidWorks preferred)
Strong knowledge of drafting best practices and the application of GD&T principles
A thorough understanding of standard manufacturing processes
Ability to design for a wide range of fabrication and manufacturing processes
Experience using and automating tests using lab equipment (Instron, LabView)
Detail oriented personality with solid documentation and reporting skills
Experience and proficiency with customer facing interactions
Excellent communication and interpersonal skills
Proficient with the Microsoft Office Suite


Engineering degree (Mechanical / Aerospace / Mechatronics) with 7 years of relevant professional experience

Profile Summary:

Employment Type : Full Time
Eligibility : Any Graduate
Industry : IT-Hardware/Networking
Functional Area : Production/Manufacturing/Maintenance/Packaging
Role : Production/Manufacturi ng/Maintenance
Salary : As per Industry Standards
Deadline : 18th Mar 2020

Key Skills:

Company Profile:

AMD India Pvt Ltdarfix

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