• Taiwan
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  • 5 - 8 Years
  • Posted : above 1 month

Job Description:

What you do at AMD changes everything

At AMD, we push the boundaries of what is possible We believe in changing the world for the better by driving innovation in high-performance computing, graphics, and visualization technologies building blocks for gaming, immersive platforms, and the data center

Developing great technology takes more than talent it takes amazing people who understand collaboration, respect, and who will go the extra mile to achieve unthinkable results It takes people who have the passion and desire to disrupt the status quo, push boundaries, deliver innovation, and change the world If you have this type of passion, we invite you to take a look at the opportunities available to come join our team

Job Title Sr Engineer / MTS (Vendor Management)

Job Descriptions
Co-work with packaging BUs on new product and technology development Assembly manufacturing facility Proactively communicate task assignments to responsible parties, and ensure that tasks are completed within the planned time Track projects to project plans Proactively report project status to stakeholders
Responsible for packaging yield, quality, cost and productivity improvement, and sustaining activities
Plan and drive for New Product Introduction activities and Ramp Up readiness
Drive Assembly manufacturer on issue resolution supporting packaging engineering
Timely execution of special work requests, with comprehensive reports
Monitor performance of Assembly manufacturing site regarding yield & quality, out of control lots disposition, and any outliers reporting from internal or external parties
Plan and execute change management from internal or external parties
Drive Assembly manufacturer to enhance process, equipment & material capability for future generation/technology products
Proactively drive towards continuous improvement in process standardization, simplification and quality enhancement, be it in internal and external environment
Site specific engineering contact to support on evaluations & to support on site audit
Assist in additional duties as deemed fit by supervisor

2 Required skill sets

Min 5 years experience in Bump/Flip Chip/Fan-out/3D_TSV Packaging Engineering experience
Possess C4 material & process knowledge (advantage)
Familiar with DOE and JMP
MS degree in Mechanical or Material or Chemical Engineering
Creative, highly motivated self-driven individual team player with the demonstrated ability to independently complete complex engineering tasks on/ahead of time/Lead & Drive for solutions and an aptitude to thrive in a fast-paced multi-tasking environment
Experience is Preparing reports /Presentation and ability to communicate Root cause and Resolution effectively
Good interpersonal communication and presentation skill
Fluent in both spoken and written English Languages

Profile Summary:

Employment Type : Full Time
Eligibility : Any Graduate
Industry : IT-Hardware/Networking
Functional Area : Production/Manufacturing/Maintenance/Packaging
Role : Production/Manufacturi ng/Maintenance
Salary : As per Industry Standards
Deadline : 15th Feb 2020

Key Skills:

Company Profile:

Company
AMD India Pvt Ltdarfix

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