• Chipset Systems and Architect Lead Jobs in Bangalore,India

  • Qualcomm Inc

Job Description:

Job Id E1974235

Job Title Chipset Systems and Architect Lead (5-10 years)

Company Qualcomm Technologies, Inc

Job Area Engineering - Hardware

Location India - Bangalore

Job Overview Member of the Chipset Systems and Architecture team contributing to system design and implementation of mobile platforms using Qualcomm chipset, and operating from Bangalore Design Center In this role the individual will define chipset architecture via exhaustive technical analyses to meet the product requirements of the target platform (phone, tablet, automotive, wearables, and other IOE segments), and optimizes for Chipset Cost, Power Distribution Network, PCB Area, eBOM, Signal Integrity and Power metrics System level end-to-end use case analyses to propose innovative solutions and architectural changes to existing and new platforms Chipset level analyses that influence product decisions right from the concept phase Work closely with Product Management, Hardware and Software architecture, Systems teams, Customer Engineering, Packaging, PCB, Components and PDN teams across global sites and time zones Exposure to latest trends in wide range of system domains and related use cases Mobile SoC, PMIC, Modem, WLAN, Camera, Display, Memory, Sensors etc Responsible for delivering the Power Grid design, PMIC requirements, Chipset level Clocking and Interface requirements for a chipset Documentation and presentation of analyses and results to core teams and management

Minimum Qualifications Bachelors degree in Engineering, Information Systems, Computer Science, or related field

4 years Hardware Engineering experience or related work experience

Preferred Qualifications 5-10 years of work experience in System level architecture, Hardware engineering or related fields preferably in the areas of mobile platforms such as smartphones/tablets/laptops or IoT platforms Strong analytical skills and familiarity with top-down engineering design Must be capable of converting high-level product requirements to architecture trade-offs and design parameters, to meet KPIs of cost, power, performance, board area etc Self-driven, Innovative and able to influence decisions based on data-driven analyses Strong communication skills, and able to coordinate across multiple teams globally Good knowledge on aspects impacting Power and its distribution Good knowledge of 2 or more mobile inter-chip interfaces (USB, PCIe, SD/eMMC, UFS, LPDDRx, CSI, DSI, SPI/I2C/SPMI/Slimbus etc) Good domain knowledge of 2 or more functional areas of Mobile SoCs such as Application Processor, Display, Camera, Video, Graphics, Modem(3G/4G/5G), WLAN, Power Management etc Exposure to entire chip development cycle spanning across Architecture, uArch, Implementation, Bring-up Experience in Validating Power/performance at a system level on boards is a plus Experience in chipset partitioning analysis, PDN analysis, or high-speed interface signal integrity/power integrity analysis and architecture is a plus Experience in defining/designing Power distribution strategies, Power regulator requirements, System Power use case analyses is a plus Experience in defining/designing Clocking methodologies/schemes is a plus Experience in System thermal analysis is a plus

Education Requirements Required Bachelors, Electrical Engineering
Preferred Masters, Electrical Engineering


Profile Summary:

Employment Type : Full Time
Eligibility : Any Graduate
Industry : IT-Hardware/Networking, Telecom
Functional Area : IT Hardware : Hardware Products & Services
Role : Embedded Technology
Salary : As per Industry Standards
Deadline : 18th Mar 2020

Key Skills:

Company Profile:

Qualcomm Incarfix

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